import of old now defunct presentation slides svn repo

4 files changed, 434 insertions, 0 deletions

diff --git a/2012/phone_hw_arch-osmug2012/c123_pcb.jpg b/2012/phone_hw_arch-osmug2012/c123_pcb.jpg
new file mode 100644
index 0000000..a9f24fc
--- /dev/null
+++ b/2012/phone_hw_arch-osmug2012/c123_pcb.jpg
diff --git a/2012/phone_hw_arch-osmug2012/phone_anatomy.pdf b/2012/phone_hw_arch-osmug2012/phone_anatomy.pdf
new file mode 100644
index 0000000..bff5f9f
--- /dev/null
+++ b/2012/phone_hw_arch-osmug2012/phone_anatomy.pdf
diff --git a/2012/phone_hw_arch-osmug2012/phone_anatomy.snm b/2012/phone_hw_arch-osmug2012/phone_anatomy.snm
new file mode 100644
index 0000000..e69de29
--- /dev/null
+++ b/2012/phone_hw_arch-osmug2012/phone_anatomy.snm
diff --git a/2012/phone_hw_arch-osmug2012/phone_anatomy.tex b/2012/phone_hw_arch-osmug2012/phone_anatomy.tex
new file mode 100644
index 0000000..59fa740
--- /dev/null
+++ b/2012/phone_hw_arch-osmug2012/phone_anatomy.tex
@@ -0,0 +1,434 @@
+% $Header: /cvsroot/latex-beamer/latex-beamer/solutions/conference-talks/conference-ornate-20min.en.tex,v 1.7 2007/01/28 20:48:23 tantau Exp $
+
+\documentclass{beamer}
+
+\usepackage{url}
+\makeatletter
+\def\url@leostyle{%
+  \@ifundefined{selectfont}{\def\UrlFont{\sf}}{\def\UrlFont{\tiny\ttfamily}}}
+\makeatother
+%% Now actually use the newly defined style.
+\urlstyle{leo}
+
+
+% This file is a solution template for:
+
+% - Talk at a conference/colloquium.
+% - Talk length is about 20min.
+% - Style is ornate.
+
+
+
+% Copyright 2004 by Till Tantau <tantau@users.sourceforge.net>.
+%
+% In principle, this file can be redistributed and/or modified under
+% the terms of the GNU Public License, version 2.
+%
+% However, this file is supposed to be a template to be modified
+% for your own needs. For this reason, if you use this file as a
+% template and not specifically distribute it as part of a another
+% package/program, I grant the extra permission to freely copy and
+% modify this file as you see fit and even to delete this copyright
+% notice. 
+
+
+\mode<presentation>
+{
+  \usetheme{Warsaw}
+  % or ...
+
+  \setbeamercovered{transparent}
+  % or whatever (possibly just delete it)
+}
+
+
+\usepackage[english]{babel}
+% or whatever
+
+\usepackage[latin1]{inputenc}
+% or whatever
+
+\usepackage{times}
+\usepackage[T1]{fontenc}
+% Or whatever. Note that the encoding and the font should match. If T1
+% does not look nice, try deleting the line with the fontenc.
+
+
+\title{Anatomy of modern cell phones}
+
+\subtitle
+{the 2012 update of the 2010 paper about 2005 phones ;)}
+
+\author{Harald Welte <laforge@gnumonks.org>}
+
+\institute
+{gnumonks.org\\hmw-consulting.de\\sysmocom GmbH}
+% - Use the \inst command only if there are several affiliations.
+% - Keep it simple, no one is interested in your street address.
+
+\date[] % (optional, should be abbreviation of conference name)
+{August 8, 2012 / OSmocom Berlin User Group}
+% - Either use conference name or its abbreviation.
+% - Not really informative to the audience, more for people (including
+%   yourself) who are reading the slides online
+
+\subject{Communications}
+% This is only inserted into the PDF information catalog. Can be left
+% out. 
+
+
+
+% If you have a file called "university-logo-filename.xxx", where xxx
+% is a graphic format that can be processed by latex or pdflatex,
+% resp., then you can add a logo as follows:
+
+% \pgfdeclareimage[height=0.5cm]{university-logo}{university-logo-filename}
+% \logo{\pgfuseimage{university-logo}}
+
+
+
+% Delete this, if you do not want the table of contents to pop up at
+% the beginning of each subsection:
+%\AtBeginSubsection[]
+%{
+%  \begin{frame}<beamer>{Outline}
+%    \tableofcontents[currentsection,currentsubsection]
+%  \end{frame}
+%}
+
+
+% If you wish to uncover everything in a step-wise fashion, uncomment
+% the following command: 
+
+%\beamerdefaultoverlayspecification{<+->}
+
+
+\begin{document}
+
+\begin{frame}
+  \titlepage
+\end{frame}
+
+\begin{frame}{Outline}
+  \tableofcontents[hideallsubsections]
+  % You might wish to add the option [pausesections]
+\end{frame}
+
+
+% Structuring a talk is a difficult task and the following structure
+% may not be suitable. Here are some rules that apply for this
+% solution: 
+
+% - Exactly two or three sections (other than the summary).
+% - At *most* three subsections per section.
+% - Talk about 30s to 2min per frame. So there should be between about
+%   15 and 30 frames, all told.
+
+% - A conference audience is likely to know very little of what you
+%   are going to talk about. So *simplify*!
+% - In a 20min talk, getting the main ideas across is hard
+%   enough. Leave out details, even if it means being less precise than
+%   you think necessary.
+% - If you omit details that are vital to the proof/implementation,
+%   just say so once. Everybody will be happy with that.
+
+\begin{frame}{About the speaker}
+\begin{itemize}
+	\item Using + toying with Linux since 1994
+	\item Kernel / bootloader / driver / firmware development since 1999
+	\item IT security expert, focus on network protocol security
+	\item Former core developer of Linux packet filter netfilter/iptables
+	\item Board-level Electrical Engineering
+	\item Always looking for interesting protocols (RFID, DECT, GSM)
+	\item OpenEXZ, OpenPCD, Openmoko, OpenBSC, OsmocomBB, OsmoSGSN
+\end{itemize}
+\end{frame}
+
+
+\section{Classic GSM phone architecture}
+
+\begin{frame}{The classic GSM phone design}
+\begin{itemize}
+	\item Classic GSM mobile phones didn't really change much for 10 years from 1992 to 2002
+	\item RF circuitry for analog RX and TX (mixers, filters, PA)
+	\item DSP for radio modem, mostly Rx side, hardware modulator
+	\item Microcontroller (often ARM7TDMI) for protocol stack + UI
+	\item VCTCXO for clock generation
+	\item Serial Port with AT-commands over RS-232
+\end{itemize}
+\end{frame}
+
+% picture of calypso based phone
+
+\begin{frame}{Improvements in classic GSM phone design}
+\begin{itemize}
+	\item DSP was becoming faster, permitted better voice codecs
+	\item DPS and controller merged in one chip/component to simply PCB design
+	\item Improvements on analog side from IF to zero-IF to low-IF designs
+	\item Smaller silicon processes for power and space savings
+\end{itemize}
+\end{frame}
+
+\section{Evolution to Smart Phones}
+
+\begin{frame}{Personal Digital Assistants}
+\begin{itemize}
+	\item In the late 1990ies, PDAs became popular (Palm, Sharp, Compaq, ...)
+	\item A PDA was a mostly pen-operated embedded device with large screen
+	\item PDAs only had RS-232 to sync with desktop PCs but no wireless interfaces
+	\item Some people connect your PDA over RS-232 to the mobile phone
+	\item But: Until 2000, SMS and CSD was the only data transport medium
+\end{itemize}
+\end{frame}
+
+\begin{frame}{From classic phone to smart phone}
+\begin{itemize}
+	\item Companies started to put a phone and a PDA in one case
+	\item Interconnection between still a normal UART with AT commands
+	\item Phone part had keyboard and display removed, AT commands are only interface
+	\item OS on PDA side much more powerful than OS on phones at that time (PalmOS, Windows CE / PocketPC, ...)
+	\item PDA-side CPU called {\em Application Processor} (AP)
+	\item Phone-side CPU called {\em Baseband Processor} (BP)
+\end{itemize}
+\end{frame}
+
+\begin{frame}{smart phone evolution}
+\begin{itemize}
+	\item GSM phone (now called "modem") gets GPRS, later EDGE support
+	\item AP gets faster (from m68k/arm7tdmi to ARM920, ARM926, ARM11....)
+	\item Color displays, higher resolutions
+	\item Mobile GPUs for video encoding/decoding, cameras, ...
+	\item Resistive touch screens replaced by capacitive touch
+	\item AP OS more full-blown (Linux, iOS, ...)
+\end{itemize}
+\end{frame}
+
+\begin{frame}{Baseband processors: An abuse of feature phone SoCs!}
+Until almost the end of the 2000's,
+\begin{itemize}
+	\item BPs continue to be made primarily for feature phones
+	\item BPs thus still contain keypad scan matrix, display interface, etc.
+	\item BPs external interfaces are primarily developed for connecting
+		the feature phone to a computer, i.e. USB.
+\end{itemize}
+Only recently, smart phones have been so popular that BPs are designed with them as
+a primary user!
+\end{frame}
+
+\begin{frame}{AP / BP memories}
+\begin{itemize}
+	\item AP and BP are separate SoCs
+	\item they each have their own address/memory bus and flash memories
+	\item those memories traditionally are in separate components for AP and BP
+	\begin{itemize}
+		\item often an integrated NOR+SRAM (later NAND+SDRAM) for the BP
+		\item SDRAM + NAND (later mDDR + eMMC) on the the AP
+	\end{itemize}
+	\item You can still see the 'two brain syndrome' from the DPA +
+		featurephone legacy
+\end{itemize}
+\end{frame}
+
+\section{Current situation and trends}
+
+\begin{frame}{2012 smart phones}
+\begin{itemize}
+	\item Has AP with two or four cores (Exynos 4412, Tegra 3, ...)
+	\item Has BP with ARM1176 core (better than AP some years ago!)
+	\item Still have the separation of AP and BP processor
+	\item Often still use AT commands to control the BP
+	\item Normally don't use UART physical interface anymore, as it's too slow for HSPA speeds
+\end{itemize}
+\end{frame}
+
+
+\subsection{AP/BP interface technologies}
+
+\begin{frame}{AP/BP interfaces}
+Many different variants exist today:
+\begin{description}[MIPI HSI]
+	\item[USB] e.g. used around 2005/2006 by Motorola EZX
+	\item[MIPI HSI] High-Speed serial interface designed specifically for phones
+	\item[HSIC] A different USB physical layer (from usb.org)
+	\item[DPRAM] Dual-Ported RAM
+\end{description}
+\end{frame}
+
+\begin{frame}{AP-BP IF: Universal Serial Bus}
+\begin{itemize}
+	\item full-speed USB significantly better than UART speeds
+	\item AP SoC often contained USB host controller anyway
+	\item BP (made for feature phones) also had USB instead of UART for PC connection
+\end{itemize}
+\end{frame}
+
+\begin{frame}{AP-BP IF: MIPI HSI}
+\begin{itemize}
+	\item HSI: High-Speed Synchronous Serial Interface
+	\item MIPI Alliance is a vendor consortium in the mobile space
+	\item They specify a variety of other interfaces, e.g. for display, battery, camera, ABB/DBB, ...
+	\item Adoption of MIPI HSI not very big (yet?) today
+\end{itemize}
+\end{frame}
+
+\begin{frame}{AP-BP IF: HSIC}
+\begin{itemize}
+	\item High-Speed Inter-Circuit specification from USB forum
+	\item removes USB phy for transmission over long wires
+	\item can transport high-speed USB (480 Mbits)
+	\item regular USB protocol stack on AP and BP
+	\item primarily used by Samsung for Infineon XGold BP
+\end{itemize}
+\end{frame}
+
+\begin{frame}{AP-BP IF: Dual-Ported RAM}
+\begin{itemize}
+	\item A RAM component with two separate Address and Data busses
+	\item Shared-Memory mailbox protocol between AP and BP
+	\item Lots of bus routing on PCB
+	\item Some AP have DPRAM internal and connect one side internally to the AP CPU core on the die
+	\item Very good match for SPoC (Smart Phone on a Chip) like Qualcomm MSM
+\end{itemize}
+\end{frame}
+
+
+\section{Smart Phone on a Chip}
+
+\subsection{Introducing the SPoC}
+
+\begin{frame}{Smart Phone on a Chip (SPoC)}
+Around the time the Google G1 came out
+\begin{itemize}
+	\item Qualcomm was offering the first integrated SPoC (MSM7200)
+	\item Integrate AP and BP CPU core + their peripherals on one chip/die
+	\item Important for reducing required PCB footprint in devices
+	\item Important for reducing PCB routing requirements
+	\item Enables deeper integration between AP and BP
+\end{itemize}
+\end{frame}
+
+\begin{frame}{SPoC AP-BP integration}
+\begin{itemize}
+	\item So far, AP and BP had their own SoCs, address/memory bus, memories, etc.
+	\item With SPoC, you can simply use the same RAM and flash chips, and somehow divide them between AP and BP
+	\begin{itemize}
+		\item part of the physical RAM is mapped into AP, another part into BP
+		\item part of the flash is accessed by the AP, another part by the BP
+		\item added benefit: you can map some RAM into both, and get a DPRAM-like shared memory mailbox interface for the AP-BP interface
+	\end{itemize}
+\end{itemize}
+\end{frame}
+
+\subsection{Industry Politics}
+
+\begin{frame}{SPoC industry politics, 1/2}
+\begin{itemize}
+	\item For years, ST-Ericsson only alternative to QC with integrated AP+BP (U8500)
+	\begin{itemize}
+		\item Infineon never had an AP business, only BP
+		\item Samsung System LSI never had a BP business, only AP
+		\item Nokia has been sleeping too long, then sold off their BP to Reensas
+		\item TI had a GSM/GPRS/EDGE BP business until 2008, then closed it down
+		\item NXP sold off their BP business and merged it with ST, later Ericsson Mobile Platforms (EMP) joined to create ST-Ericsson.  They all lack a BP business
+	\end{itemize}
+\end{itemize}
+\end{frame}
+
+\begin{frame}{SPoC industry politics, 2/2}
+\begin{itemize}
+	\item Industry politics, continued
+	\begin{itemize}
+		\item Broadcom has APs, but never been very successful in the BP market
+		\item Intel once had an AP business (X-Scale, PXA25x,26x,27x), but sold it to Marvell
+		\item Marvell had integrated AP + GSM/GPRS/EDGE BP, but no WCDMA
+	\end{itemize}
+	\item Do you understand why Intel bought the Infineon BP business?
+\end{itemize}
+\end{frame}
+
+\subsection{Routing around the problem}
+
+\begin{frame}{Industry finds SPoC alternatives}{Samsung}
+If you cannot get AP+BP in one package, you have to be innovative
+\begin{itemize}
+	\item Samsung has long successful AP line (s3c24xx, s3c6410, Exynos)
+	\begin{itemize}
+		\item They also build mDDR and NAND flash as well as SD card controllers
+		\item They build MCP (Multi Chip Package) with multiple dies in one package
+		\item Reduces need for external memory components, simplifies PCB routing
+	\end{itemize}
+\end{itemize}
+\end{frame}
+
+\begin{frame}{Industry finds SPoC alternatives}{Texas Instruments}
+If you cannot get AP+BP in one package, you have to be innovative
+\begin{itemize}
+	\item TI has successful OMAP3/OMAP4 AP business
+	\begin{itemize}
+		\item They have no RAM/flash business, thus cannot do MCP
+		\item They start with PoP (Package on Package)
+		\item Idea: expose memory interface on top of SoC, then solder memory BGa on top of SoC
+		\item Saves PCB footprint and simplifies routing, but adds height!
+	\end{itemize}
+\end{itemize}
+\end{frame}
+
+\subsection{The odd SPoC alternatives}
+
+\begin{frame}{Have it the Mediatek way}{The MTK GSM/GPRS/EDGE chipsets}
+\begin{itemize}
+	\item Users want features, they don't care about separate AP/BP
+	\item So instead of adding an AP to a feature phone, just add all the peripherals and software to the BP
+	\item Result: ARM7TDMI, later ARM920-EJS BP with hardware codec, GPU, lots of memory, JAVA, ...
+	\item Lots of applications like web browser, mail, games to make it look like a real smartphone
+	\item You save a lot in silicon footprint and ARM core licensing
+	\item Shipped up to 90 Million units / quarter !
+\end{itemize}
+\end{frame}
+
+\begin{frame}{Mediatek 3G Evolution}
+\begin{itemize}
+	\item Mediatek buys BP business from ADI (Analog Digital)
+	\item This most likely included Blackfin-based 3G baseband
+	\item Modern MTK chipsets are SPoC, with ARM9/ARM11 on AP side and ARM9 on BP
+	\item Shared memory components akin to Qualcomm solution
+	\item How can MTK become successful once they sell outside China (WCDMA patent licenses to QC?)
+\end{itemize}
+\end{frame}
+
+\begin{frame}{The ST-Ericsson low-cost solution}
+\begin{itemize}
+	\item Use a single CPU core for AP and BP
+	\item Run a hypervisor on it to virtualize the hardware
+	\item Run BP OS in one guest compartment, AP in another
+	\item Save on silicon cost/size and ARM core licensing like MTK
+	\item Used in very few phones
+\end{itemize}
+\end{frame}
+
+\begin{frame}{AP/BP chipset market distribution}
+Out of ~ 70 phone models available on German market today,
+\begin{itemize}
+	\item Distribution by vendor
+	\begin{itemize}
+		\item 47 are Qualcomm BP based (mostly SPoC)
+		\item 17 are Infineon BP based (BP-only)
+		\item 5 are ST-Ericsson based (SPoC / 2 core)
+	\end{itemize}
+	\item Distribution by AP/BP interface
+	\begin{itemize}
+		\item 54 use shared memory interface
+		\item 8 use HSIC or USB
+		\item 4 use MIPI HSI
+	\end{itemize}
+\end{itemize}
+Careful: This is per models.  Some models sell more units than 10 other models together ;)
+\end{frame}
+
+
+\begin{frame}{Thanks}
+Thanks for your attention.  I hope we have time for Q\&A.
+\end{frame}
+
+
+\end{document}